Microelectronics Process Integration/Device Engineer (level 3/4) - Northrop Grumman Corporation
Northrop Grumman Mission Systems seeks to fill the position of Microelectronics Process Integration/Device Engineer in the Advanced Concepts and Technologies Division (AC&T).
The position is located at the Advanced Technology Lab (ATL) - situated just outside of Baltimore, MD - where we design, manufacture, and test semiconductor products for internal and commercial production as well as emerging technology programs.
Our semiconductor foundry is a unique capability supporting a range of production microelectronic devices (Silicon, Silicon Germanium, Gallium Arsenide, Gallium Nitride, Silicon Carbide) and providing leading edge technology development in novel devices and superconducting electronics. Our devices enable a number of Northrop Grumman’s ground based radars, avionic radars, and space systems. Enjoy the opportunity to grow and learn with a variety of challenging projects in R&D, ongoing long term programs, and new programs targeting future military platforms.
The Microelectronics Process Integration/Device Engineer is responsible for the development and qualification of new devices and the creation of integrated processes supporting several technologies including compound semiconductors, novel materials, and advanced node CMOS and BiCMOS. Applicants should have in-depth knowledge of semiconductor device physics and experience in microelectronics device fabrication. Duties include process flow ownership and continuous improvement, defining device structures, analyzing process experiment data, coordinating process experiments, and device qualification. Candidate should have the ability to develop advanced technological ideas and guide their development to a final product. He/she must also have the ability to communicate with employees at all levels in the organization and be able to demonstrate excellent problem solving, data analysis, and critical thinking skills.
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• Post ID: 23808933 baltimore