Posted: Thursday, March 16, 2017 10:35 AM
Northrop Grumman Mission Systems Sector is searching for an Architect for next generation SoC and Mixed Signal ASIC solutions in support of future RF sensor systems, EO/IR sensor systems, processing systems and other emerging business areas for our nation’s next generation security and defense platforms. This person will have a technology leadership position that will span multiple roles: Providing direction and oversight to internal and external design teams supporting semiconductor process selection, IP selection, chip development and verification, physical design, packaging and software Working with internal program management to develop realistic estimates for development cost, risk and schedule for advanced SoCs and Mixed-Signal ASICs Develop architectures within existing organizational constraints for SoCs and mixed-signal ASICs Working with interdisciplinary teams to develop a system architecture and allocating functionality to system components such as SoCs, mixed-signal ASICs, RF ICs and FPGAs Responsibilities Further define, drive, and streamline overall ASIC process using commercial world practices Define and drive the overall SoC, Mixed-Signal ASIC, IP and system architecture requirements for Interface and Peripheral IP Work with and provide direction to the Chip and IP verification teams to develop, review, and approve pre- and post-silicon validation/test plans Work with the Physical Design, Packaging, and Board design teams to evaluate floorplan and packaging/IO implementation options and associated tradeoffs Work with System, Software, RF, Security, and Platform architects to define the overall architecture to meet the product requirements Monitor and participate in the development of industry standards This requisition may be filled at a higher grade based on the qualifications listed below.
Click here for more info: https://ngc.taleo.net/careersection/jobdetail.ftl?job=17005144&lang=en
• Location: Baltimore
• Post ID: 19402447 baltimore